Contents
What is Uson package?
The Plastic Ultra-Thin Small Outline No-lead Package(USON) is a rectangular semiconductor package with metal terminals along two sides of the bottom of the package. The terminals are either flush with bottom or protruding slightly below bottom of package. The main body of the component is generally a molded plastic.
How are QFN packages made?
Every QFN package consists of a LeadFrame, which is a copper frame surrounding the die and consists of all the package pads (fingers) and the exposed pad. A leadframe is typically made as a large flat sheet of copper with 0.3-0.4 mm thickness with Matt Tin coating.
What does QFN stand for?
quad-flat no-leads
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.
What are leadframes?
The leadframe is a thin metal plate part to be used in semiconductor packages such as IC, LSI, etc. While it supports and fixes an IC chip, its other role is to function as connection pins when the chip is mounted on a printed wiring board.
Is the Uson the same as the utdfn?
JEDEC describes the USON as: The Plastic Ultra-Thin Small Outline No-lead Package(USON) is a rectangular semiconductor package with metal terminals along two sides of the bottom of the package.
What are the terminals on a Uson package?
The Plastic Ultra-Thin Small Outline No-lead Package (USON) is a rectangular semiconductor package with metal terminals along two sides of the bottom of the package. The terminals are either flush with bottom or protruding slightly below bottom of package. The main body of the component is generally a molded plastic.
What is the body thickness of utdfn pads?
The body thickness of UTDFN packages typically ranges from 0.40 mm to 0.55 mm. The pad pitch (distance between pads) used by UTDFN packages is usually either 0.4 mm or 0.5 mm. Table 1. Properties of Some Examples of UTDFN’s
Is the son package the same as the DFN package?
It looks like SON and DFN refer to the same package. JEDEC documents like this one talk about “SON/QFN”, but on the whole JEDEC site I couldn’t find one reference to “DFN”. On the other hand, among its dozens of packages Linear Technology lists DFN and QFN, but there’s no trace of SON.