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Can emitter and collector be interchanged?
No, we cannot interchange emitter and collector of a transistor due to following reasons: (i) In a transistor emitter is heavily doped and collector is comparatively lightly doped. (ii) In a transistor, the contract area of emitter- collector junction is larger than that of emitter- base junction.
How do you identify emitter and collector base?
In NPN type, the pin close to the Tab is Emitter, the opposite one, the Collector and the middle one, base. In PNP type the pins are reversed. Pin close to the Tab is Collector. To identify a Field Effect Transistor, one should keep the curved portion facing him/her and start counting in the anti-clockwise direction.
Can we change emitter and collector of a transistor?
We cannot change their positions because doping concentrations are different for emitter , collector and base .
Is there a standard for BJT transistors in a SOT-23 package?
I’ve searched on google and on this forum and haven’t found any info in regards to sot-23 package and the 2n4403 and 2n4401 bjt’s. In the datasheets for these parts. They don’t say the pinout for them meaning what pin number goes to either the base, emitter, or collector. Is there a standard for bjt transistors in a sot-23 package?
Where can I find a picture of the SOT-23 package?
If you open the datasheets that you linked to, you will find that on the very first page, a picture of the sot-23 package with the pins marked on it. Not open for further replies.
Where do you put the BJT in a transistor?
Build: Place the BJT on the breadboard with the flat side facing you. The left pin is the E mitter, the right pin is the C ollector, and the middle pin is the B ase. Connect the 10kΩ resistor between the switch and the base pin.
How is heat transfer performed on the SOT-23?
Case temperature. Because the SOT-23 is a Surface Mount Device [SMD] heat transfer will also be conducted via the component leads. There are no leads to shorten to increase heat conduction as in a thru-hole component. The TO-236 has to be mounted to a Printed Circuit Board [PCB] so the lands or PWB pads are used to transfer heat.