How to select electronic components in product design?

How to select electronic components in product design?

Surprisingly, many engineers do not pay enough attention to the task of selecting the right electronic component during the initial phase of their embedded product design. Selecting the right electronic component is one of the most critical & challenging aspects of product design.

How big decoupling capacitor should I use for my digital ICs?

If we suppose the threshold for the ON state is 4.5 V, then the voltage dip that needs to be compensated is 0.5 V in order to prevent bit errors. Furthermore, this must be compensated within 6 ns. Therefore, the minimum decoupling capacitance is: Here, you should use—at least—a 6 nF capacitor to compensate a 0.5 V maximum voltage within 6 ns.

How many components does a power IC need?

Some power IC solutions may require as few as three external components, such as an ADP2108 buck regulator. Because it has internal power switches, this switch mode regulator requires but three external components: an input and an output capacitor and one inductor.

How to calculate a capacitive load on a digital IC?

Let’s look at a capacitive load on a digital IC with multiple switching outputs. The best way to show how to use this equation for a capacitive load is with an example. Suppose you have a digital IC with 12 outputs, where each output signal is 5 V with 6 ns rise time. Each output drives a load with 50 pF load capacitance.

When does a failure of an electronic component occur?

Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates. Burn-in procedures are used to detect early failures.

What can be used to check the integrity of a semiconductor?

As some semiconductors like silicon and gallium arsenide are infrared-transparent, infrared microscopy can check the integrity of die bonding and under-die structures. Red phosphorus, used as a charring-promoter flame retardant, facilitates silver migration when present in packaging.

What causes the failure of a semiconductor device?

Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.