What are the pitch sizes for BGA devices?
General BGA and PCB Layout Overview. Introduction. Xilinx® UltraScale™ architecture, 7 series, and 6 series devices come in a variety of packages that are designed for maximum perf ormance and maximum flexibility. Three pitch sizes are available for these packages: 1.0 mm, 0.8 mm, and 0.5 mm.
How big should SMD pads be compared to BGA pads?
If SMD pads are used on the PCB, the surface land pads should be the same size as the BGA pad to provide a balanced stress on solder joints. If non-solder mask defined pads are used on the PCB, the land pads should be approximately 15% smaller than the BGA pad size to achieve a balanced stress on solder joints. Figure 5. BGA Pad Dimensions
What’s the difference between NSMD and SMD pads?
Xilinx recommends using Non Solder Mask Defined (NSMD) copper BGA landing pads for optimum board design. NSMD pads are pads that are not covered by any solder mask, as opposed to Solder Mask Defined (SMD) pads in which a small amount of solder mask covers the pad landing. Figure 1-2 illustrates the difference between NSMD and SMD pads.
Is it OK to drill with a 0.5mm pitch?
Since the pitch is so fine, there is no room for vias between the pads, even at the smallest drill size of 0.2mm. For this reason, I have placed the decoupling capacitors on the same side as the BGA, rather than on the opposite side, as is usually recommended. The board thickness is 0.8mm. The passives are all 0201 packages.
What’s the minimum trace width for a BGA device?
Standard PCB processes can allow for as low as 3.5 mil trace widths with 3.5 mil spacing. Advanced processes can allow for as low as 2 mil trace widths with 2 mil spacing. Due to the very fine pitch of 0.5 mm devices, only one signal can be routed in between BGA balls, as shown in Figure 5-3 and Figure 5-4.
How big should a BGA pad be on a PCB?
The ball pitch and BGA pad/via diameters determine how much space is available to route traces between pads or vias. Standard PCB processes can allow for as low as 3.5 mil trace widths with 3.5 mil spacing. Advanced processes can allow for as low as 2 mil trace widths with 2 mil spacing.