Contents
What is tPlace Layer in EAGLE?
# Layer 21 – tPlace This layer contains the top side silk screen. It usualy contains the component outlines. Care must be taken not to cover any ares that have to be soldered. It is also possible to create additional and rather betterlooking silk screen for documentation purposes in layer 51, tDocu.
What is tPlace?
tPlace is a layer used for visible lines (for example, component outlines) that will be laid as silkscreen in the manufacturing process. tDocu is used for documentation, such as mechanical dimensions.
What is the name of Layer 17 in EAGLE?
Standard layers
| Function | EAGLE name | |
|---|---|---|
| Function | Bottom Layer | 16 |
| Function | 17 | |
| Function | 18 | |
| Function | Solder-stop Top | 29 |
What are the different layers in EAGLE PCB?
Each ‘layer’ in Eagle has a dedicated number, and these layers are used to separate all the types of content that make up your PCB or your parts: These layers contain documentation details (layer 51), actual manufacturing info such as the ‘paste layer’ (layer 31), the copper layers for you pads (layer 1), etc.
Is there a silk screen layer in tdocu?
It is also possible to create additional and rather betterlooking silk screen for documentation purposes in layer 51, tDocu. This may indeed cover soldered areas, since it is not output along with the manufacturing data. This layer contains the bottom side silk screen (see layer 21 for more details).
What does the dimension layer on an eagle board mean?
Since Eagle expects the board edge on this layer, our service uses the Dimension layer to generate a board outline gerber. Our fab will then use that layer to cut your board out from the fabrication panel. These layers indicate spots where the fab should avoid putting the purple solder resist.
Where are tracks not to be placed on a PCB?
Tracks should not be placed in this area. This layer is the bottom side keepout area for tracks (see layer 41 for more details). This layer is the keepout area for vias. This layer contains the conducting through holes. It is usually used for pads (of through hole components) and vias. This layer contains the non-conducting holes.