Contents
What is trace size?
Trace widths are often measured in mils, or thousands of an inch. A standard trace width for an ordinary signal (no special requirements) may be in the 7-12 mil range and be as long as a few inches, but there are many things that should be considered when defining the width and length of a trace.
How do I manage my BGA routing?
To facilitate routing in the ball grid area, necking down the trace width in the critical space between the BGA pads/vias (the breakout area) is allowable. This then allows for two signal rows to be routed on a single metal layer (or three if routing the outermost row).
What is the purpose of BGA?
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
What’s the minimum trace width for a BGA device?
Standard PCB processes can allow for as low as 3.5 mil trace widths with 3.5 mil spacing. Advanced processes can allow for as low as 2 mil trace widths with 2 mil spacing. Due to the very fine pitch of 0.5 mm devices, only one signal can be routed in between BGA balls, as shown in Figure 5-3 and Figure 5-4.
What are the pitch sizes for BGA devices?
General BGA and PCB Layout Overview. Introduction. Xilinx® UltraScale™ architecture, 7 series, and 6 series devices come in a variety of packages that are designed for maximum perf ormance and maximum flexibility. Three pitch sizes are available for these packages: 1.0 mm, 0.8 mm, and 0.5 mm.
How big is a trace between a BGA ball?
The ball pitch and BGA pad/via diameters determine how much space is available to route traces between pads or vias. Standard PCB processes can allow for as low as 3.5 mil trace widths with 3.5 mil spacing. Advanced processes can allow for as low as 2 mil trace widths with 2 mil spacing. Trace Routing Between BGA Balls
How big should a BGA pad be on a PCB?
The ball pitch and BGA pad/via diameters determine how much space is available to route traces between pads or vias. Standard PCB processes can allow for as low as 3.5 mil trace widths with 3.5 mil spacing. Advanced processes can allow for as low as 2 mil trace widths with 2 mil spacing.